Encapsulated ultrasound transducer probe assembly
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United States of America Patent
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Sep 22, 1998
Issued Date -
N/A
app pub date -
Aug 22, 1997
filing date -
May 7, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of encapsulating an ultrasound transducer assembly probe is disclosed. The encapsulation forms a seamless casing around the entire transducer probe assembly resulting in sealed leak-proof probe conducive to sterilization by immersion in a disinfectant liquid. The encapsulation method of the present invention simplifies the manufacturing process by eliminating several processing steps such as backpotting, welding, backfilling, and strain relief closing of the multiple component prior art construction. The method provides for device that is less expensive to produce, easily repaired and/or upgraded, more reliable, feels more comfortable to the user, and the patient and lends itself readily for mass production.
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