Adhesive wafer with embossed skin-contacting surface
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United States of America Patent
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Sep 22, 1998
Grant Date -
N/A
app pub date -
Apr 30, 1996
filing date -
Apr 30, 1996
priority date (Note) -
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Abstract
An adhesive wafer, which is especially suitable for use as a faceplate for an ostomy appliance but may also be used as a wound dressing, has an adhesive layer of hydrocolloid-containing skin barrier material and a flexible backing layer extending over one surface of the adhesive layer. The opposite skin-contacting surface of the adhesive layer is embossed to provide a pattern of discrete, non-connecting depressions separated and isolated from each other by flat-topped ridges dimensioned and arranged so that a skin surface engaged by said embossed surface primarily contacts only such ridges.
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