Low temperature bonding of materials
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United States of America Patent
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Sep 22, 1998
Grant Date -
N/A
app pub date -
Oct 23, 1996
filing date -
Oct 23, 1996
priority date (Note) -
Expired
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Abstract
A method for joining a first metal surface to a second metal surface that includes providing powder metal particles substantially all of which have hardnesses lower than the hardnesses of the first and second metal surfaces, at normal temperatures; locating the particles in a layer between the first and second metallic surfaces, to form an assembly; heating the assembly to an elevated temperature or temperatures below the softening temperature of the first and second metallic surfaces; and effecting compression of the layer by and between the first and second surfaces at a pressure level or levels below the compressive yield strengths of the first and second surfaces, and above the compressive yield strengths of the particles, and for a time duration to effect a bond between the first and second metallic surfaces.
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