Importance

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Abstract

When a semiconductor chip is mounted on a wiring substrate, an end of a metallic wire fed through a capillary is first fused to form a ball, which is in turn pressed against and bonded to an electrode pad formed on a semiconductor chip. The metallic wire is then cut at a location in the proximity of the ball so that a portion of the metallic wire remains as a protruding contact on the ball. The protruding contact is pressed against a shaping platform coated with a paste-like electrically-conductive adhesive film to thereby cause the protruding contact to have a given height and transfer a portion of the adhesive film to the protruding contact. The protruding contact is eventually bonded to an electrically-conductive film formed on the wiring substrate via the transferred portion of the adhesive film.

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First Claim