Low temperature method for mounting electrical components
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United States of America Patent
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Sep 29, 1998
Issued Date -
N/A
app pub date -
Aug 9, 1996
filing date -
Nov 3, 1993
priority date (Note) -
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Abstract
A method for low temperature attachment of components is provided which uses an electrically conductive adhesive. The electrically conductive adhesive may be defined by a substrate having numerous passageways through the substrate. The passageways are defined by a plurality of walls of the material making up the substrate. The walls are covered with a layer of conductive metal. The passageways at the outer surfaces are filled with a non-conductive pressure sensitive adhesive resin.
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