Sputtering system using cylindrical rotating magnetron electrically powered using alternating current
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United States of America Patent
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Sep 29, 1998
Issued Date -
N/A
app pub date -
Oct 25, 1996
filing date -
Apr 25, 1995
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Abstract
A sputtering system using an AC power supply in the range of 10 kHz to 100 kHz uses two rotatable cylindrical magnetrons. The rotatable cylindrical magnetrons, when used for depositing a dielectric layer onto a substrate, clean off dielectric material that is deposited onto the target. This prevents a dielectric layer on the target from acting like a capacitor and may help avoid arcing. Additionally, an impedance-limiting capacitor can be placed in series in the electrical path between the targets through the transformer so as to reduce arcing. This impedance-limiting capacitor has a value much larger than the capacitors used to couple the power supply to a target in radio frequency sputtering systems.
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