Packaging multiple dies on a ball grid array substrate
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United States of America Patent
Stats
-
Sep 29, 1998
Grant Date -
N/A
app pub date -
Mar 25, 1997
filing date -
Mar 25, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electrical arrangement including a circuitized substrate, the circuitized substrate having (i) a first substrate surface including a set of substrate contacts disposed thereon, and (ii) a second substrate surface including a set of input/output contacts disposed thereon. The electrical arrangement also includes a first die having (i) a first die surface including a set of first die contacts disposed thereon which is coupled to a first portion of the set of substrate contacts, and (ii) a second die surface configured to receive a second die. In the electrical arrangement, the set of substrate contacts includes a second portion of substrate contacts configured to be coupled to a set of second die contacts disposed on the second die and the circuitized substrate electrically interconnects the first portion and second portion of the set of substrate contacts and the set of input/output contacts to form a predetermined circuit.
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