Fabrication of thermoelectric modules and solder for such fabrication
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United States of America Patent
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Oct 6, 1998
Issued Date -
N/A
app pub date -
Sep 16, 1996
filing date -
Oct 3, 1995
priority date (Note) -
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Abstract
A thermoelectric module is formed with a solder joint, the solder containing about 50 to 99 weight percent bismuth and about 50 to 1 weight percent antimony, between the thermoelectric elements and the connecting conductors. Also provided is a thermoelectric module having bismuth telluride elements coated with a conductive material that does not require a nickel or other diffusion barrier. Further provided are modules having conductors with a phosphorus-nickel surface. Methods of manufacturing and using such thermoelectric modules are further provided.
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