Methods and apparatus for a full width ultrasonic bonding device
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United States of America Patent
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Oct 6, 1998
Grant Date -
N/A
app pub date -
Mar 7, 1997
filing date -
Dec 20, 1996
priority date (Note) -
In Force
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Abstract
This invention relates to apparatus and methods for fabricating a web or consolidating web precursor material in fabricating a web. The invention comprises ultrasonic bonding apparatus including an anvil roll receiving web materials thereon and receiving first and second rotary ultrasonic horns. The rotary ultrasonic horns, in combination with the anvil roll, ultrasonically bond segments of e.g. first and second webs to each other. Third and fourth rotary ultrasonic horns spaced about the circumference of the anvil roll, in combination with the anvil roll, ultrasonically bond other segments of the webs to each other. The full widths of the webs can be ultrasonically bonded using the rotary ultrasonic horns. An outer surface of the anvil roll preferably carries a bonding pattern defining the locations where bonding of the webs occurs. Additional e.g. third and fourth webs can be bonded by the ultrasonic bonding apparatus. Such bonding can occur after first and second webs have been bonded to each other by first and second rotary ultrasonic horns. In some instances, the third and fourth rotary ultrasonic horns can ultrasonically bond portions of the first and second webs that have already been bonded together by one or both of the first and second rotary ultrasonic horns. In other embodiments, multiple repeat bonding of substantially the same segment of the web can occur. In still other embodiments, a batt of bondable material such as fibers can be consolidated by ultrasonic bonding with rotary ultrasonic horns to form a unitary web. The apparatus can operate at web speeds greater than 1000 feet minute.
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- 15 United States
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- 5 Korea
- 2 Other
Patent Owner(s)
| Patent Owner | Address | |
|---|---|---|
| KIMBERLY-CLARK WORLDWIDE INC | 2300 WINCHESTER ROAD NEENAH WI 54956 |
International Classification(s)
Inventor(s)
| Inventor Name | Address | # of filed Patents | Total Citations |
|---|---|---|---|
| Brennecke, Craig Steven | New London, WI | 1 | 165 |
| Cottingham, Jeffery Ray | Appleton, WI | 1 | 165 |
| Klemp, Paul Gordon | Hortonville, WI | 4 | 361 |
| Samida, Jeffrey Joseph | Appleton, WI | 4 | 399 |
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| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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