Methods of fabricating an HDMI decal chip scale package
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United States of America Patent
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Oct 6, 1998
Grant Date -
N/A
app pub date -
Mar 20, 1997
filing date -
Mar 20, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Methods of producing a chip scale package that enables any chip with peripheral bond pads to be converted to an area array chip scale package suitable for chip on board assembly. The present invention produces the equivalent of a flip chip die when a chip supplier does not provide one. Processing is performed that provides thin film metal interconnections between the chip bond pads and area array bond pads on the bottom of the package. High reliability thin film metal interconnections are thus provided that connect the bond pads of the chip to the area array bond pads to permit external connection to the chip.
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