Package for housing a semiconductor element
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United States of America Patent
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Oct 6, 1998
Grant Date -
N/A
app pub date -
May 23, 1996
filing date -
Jan 20, 1995
priority date (Note) -
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Abstract
A semiconductor element-housing package which hermetically houses a semiconductor element for protection against moisture in the atmosphere by bonding an insulating substrate and a lid by means of a sealing material, with a moisture absorbent having surface pores 10-100 .ANG. in radius which is mixed in the insulating substrate and/or the sealing material formed of a resin.
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