Heat dissipating computer case having oriented fibers and heat pipe
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Oct 6, 1998
Grant Date -
N/A
app pub date -
Jan 9, 1997
filing date -
Jan 9, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The apparatus is a cooling structure for laptop computers, in which the heat is transferred to a heat pipe in the cover of the case behind the display screen. The heat pipe behind the screen is interconnected with the external wall of the cover by a holding fixture which, preferably, is integrated into the cover wall during manufacture. The cover is specially constructed with high thermal conductivity carbon fibers which are oriented to preferentially conduct heat from the heat pipe to the cover and to spread the heat over the entire external surface of the cover for dissipation into the environment.
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