Interconnecting blister package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5819939
SERIAL NO

08956321

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A thermoformed thermoplastic blister is connected to a backing card. The blister has a peripheral flange which is positioned adjacent the backing card, and a bubble which protrudes frontwardly from the flange. A catch is formed in the flange, and is deformed rearwardly through an opening in the card to extend downwardly. The plastic catch extends into a narrow slot on the bubble of another like package. The slot is approximately the same width as the catch and need be only slightly taller than the thickness of the flange. With this connection structure multiple packages may be supported one upon another. In addition, the packages will automatically link to one another when extracted from a shipping carton. The rearwardly protruding catch may be formed from the plastic flange alone, or may be formed together with a portion of the backing card for additional strength. The plastic catch may be deformed by heat or pressure, or may be held in a rearwardly extending position by interaction with configured slots on the backing card. Alternatively, the flange may be molded to deform a portion of the backing card to act as the catch. More than one catch and slot may be formed in a package to support greater loads with improved balance.

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First Claim

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Patent Owner(s)

  • PLACON CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Boyer, David C Madison, WI 23 175

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