Semiconductor device and process and leadframe for making the same
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United States of America Patent
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Oct 13, 1998
Grant Date -
N/A
app pub date -
Nov 6, 1995
filing date -
Nov 7, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device which comprises a first lead having a tip formed with an island, a semiconductor chip unit mounted on the island of the first lead by means of a solder layer and having a plurality of electrode bumps projecting away from the island, and a plurality of additional leads each of which has a tip electrically connected to the electrode bumps via respective solder deposits. The additional leads include at least second and third leads. The tips of the second and third leads are at least partially wider than the semiconductor chip.
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