Importance

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Abstract

A card type semiconductor device includes a main circuit board and a first sub-circuit-board equipped with a main memory. The main circuit board is connected to the first sub-circuit-board through an FPC. A first TCP equipped with the CPU and a second TCP equipped with the I/O sub-system chip are mounted on the top and bottom surfaces of the main circuit board. The first and second TCPs are mounted to directly oppose each other. The card type semiconductor device is used as a card type computer. The main circuit board and the sub-circuit-board face each other by bending the FPC and enclosing the main circuit board and the sub-circuit-board in a card-shaped thin housing. The card type semiconductor device achieves a high density packaging in a small form factor. The card type semiconductor device supports high speed operations and provides a structure for adaptation to new applications quickly and inexpensively by allowing easy replacement of the sub-circuit-board with other sub-circuit boards that perform a wide range of functions.

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First Claim