Surface acoustic wave device and method of manufacture
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United States of America Patent
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Oct 13, 1998
Grant Date -
N/A
app pub date -
May 8, 1996
filing date -
May 8, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A compact, low height, low cost, and high reliability surface acoustic wave device, and its method of manufacture. The surface acoustic wave device consists of a substrate, a comb-electrode disposed on the main surface of the substrate, plural electrode pads disposed around the comb-electrode, protecting means covering the comb-electrode through a closed space produced by combining the comb-electrode and the electrode pads with the substrate by using substantially covalent bonding force acting between conductive bumps formed on the electrode bumps, a conductive adhesive layer disposed at least on the top of the conductive bumps, and a package adhered on the conductive bumps by means of the conductive adhesive, and insulation adhesive filled into the package contacting the conductive adhesive, the conductive bumps and the protective means.
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