Multilayer feedthrough capacitor

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United States of America Patent

PATENT NO 5822174
SERIAL NO

08683723

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Abstract

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A multilayer feedthrough capacitor of the present invention has an internal structure of stacking one over another alternately dielectric sheets 1a, on each of which signal feedthrough electrodes 2a, 2b and 2c and separating earth electrodes 7a and 7b are disposed alternately, and dielectric sheets 1b, on each of which earth electrodes 3a and 3b having protrusions 8a and 8b, respectively, are formed. On one pair of the end surfaces of this stacked dielectric body are formed first external electrodes 4a, 4b and 4c that are connected to signal feedthrough electrodes 2a, 2b and 2c, respectively, and third external electrodes 9a and 9b that are connected to both separating earth electrodes 7a and 7b and protrusions 8a and 8b, respectively. On the other pair of the end surfaces are formed second external electrodes 5a and 5b that are connected to earth electrodes 3a and 3b, respectively. By having separating earth electrodes 7a and 7b arranged between signal feedthrough electrodes 2a, 2b and 2c, it has become possible to suppress generation of crosstalk and also to improve insertion loss characteristics in the high frequency band.

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Patent Owner(s)

Patent OwnerAddress
MATSUSHITA ELECTRIC INDUSTRIAL CO LTDJAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Watanabe, Chikara Osaka, JP 5 115
Yamate, Kazunori Ibaraki, JP 16 155

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