Process of making an integrated circuit chip composite
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United States of America Patent
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Oct 20, 1998
Issued Date -
N/A
app pub date -
Jul 5, 1996
filing date -
Dec 10, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A composite containing an integrated circuit chip having conductive site thereon and electrically conductive leads that are interconnected to the conductive site by electrically conductive wire; wherein the wire is coated with a dielectric material. Also, a method for fabricating the composite is provided.
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