Electronic package with enhanced pad design
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United States of America Patent
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Oct 20, 1998
Grant Date -
N/A
app pub date -
Jun 3, 1997
filing date -
Oct 3, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
An electronic package (400), particularly a BGA, including a circuitized substrate (120) and one or more active devices (110) attached thereon by means of corresponding conductive pads provided on a surface of the substrate (120); each conductive pad is splitted in a plurality of parts (212-218) not in contact. Such parts (212-218) may be separated by a wireable area of the substrate (120), thereby providing one or more wiring channels. In addition, the same parts (212-218) may be connected in interfacing couples at different electrical potentials (ground and power) and decoupled to each other by means of capacitors (410); the connections to the ground and power are achieved by metallized holes provided through the substrate (120).
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