Method for connecting two substrates in a thick film hybrid circuit
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United States of America Patent
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Oct 20, 1998
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N/A
app pub date -
Apr 16, 1997
filing date -
Apr 16, 1997
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Abstract
Two hybrid circuit components are connected to one another by a ceramic block. Electrical connections are made between the hybrid components by conductive vias through the ceramic block. The ceramic block is disposed toward an edge of the hybrid components so that integrated circuits and/or discrete electrical components may be attached to a major portion of both surfaces of each hybrid substrate. The interconnected hybrid components form a compact electrical device, for example, a hearing aid.
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