Importance

Loading Importance Indicators...

Abstract

A method and apparatus through which there may be delaminated, within the context of a pick-and-place processing method, an integrated circuit die from an adhesive tape backing. To practice the method of the present invention, there is first provided upon an adhesive tape backing an integrated circuit die. The adhesive tape backing comprises a carrier layer and an adhesive layer formed over the carrier layer, where the adhesive layer is positioned between the integrated circuit die and the carrier layer. The adhesive layer has a first portion of the adhesive layer upon which is positioned the integrated circuit die. The adhesive character of the first portion of the adhesive layer is susceptible to substantially complete degradation through exposure to a dose of radiation. There is then exposed selectively the first portion of the adhesive layer to the dose of radiation, preferably ultra-violet (UV) radiation. Finally, the integrated circuit die is removed from the adhesive tape backing. The invention also contemplates an apparatus through which the method of the present invention may be practiced and an ultra-violet (UV) sensitive adhesive tape backing which may be employed within the method and apparatus of the invention.

Loading the Abstract Image...

First Claim