Naphthalene and or biphenyl skeleton containing epoxy resin composition
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United States of America Patent
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Oct 27, 1998
Issued Date -
N/A
app pub date -
Feb 6, 1997
filing date -
Jan 26, 1994
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Abstract
An epoxy resin composition is provided that mainly comprises an epoxy resin, a curing agent, and an inorganic filler, and that cures into a product having a coefficient of water diffusion of up to 1.times.10.sup.-4 cm.sup.2 /hr. at a thickness of 3 mm under humid conditions at 85.degree. C. and RH 85%, wherein 1-50% by weight of an inorganic water absorbing agent such as molecular sieve, silica gel and porous silica is added to the epoxy resin composition. The composition offers cured products having fully low moisture permeability and is thus suitable as a pre-molded hollow package-forming material.
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