Homogeneous chip carrier package
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United States of America Patent
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Oct 27, 1998
Issued Date -
N/A
app pub date -
Nov 14, 1994
filing date -
May 26, 1994
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A thermoplastic chip carrier cavity package for one or more semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP. A casing is further formed atop the substrate with the casing being made of the suitable thermoplastic and being chemically fused to a portion of the circuit substrate to create a moisture seal therebetween. An encapsulant for filling the cavity within the casing and a lid may also be utilized to further secure and seal the chip mounted therein from moisture.
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