Head transducer to suspension lead termination by solder ball place/reflow
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United States of America Patent
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Oct 27, 1998
Issued Date -
N/A
app pub date -
Jun 27, 1996
filing date -
Jun 27, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
A method for forming electrical solder connections between a thin film magnetic head transducer and the conductors in an integrated suspension after the head has been mechanically attached to a suspension. A solder ball is placed between the head and conductor termination pads. A focused laser beam is used to produce solder reflow. The resulting solder connection has a very fine grain structure and includes a pair of extremely thin layers of intermetallic compounds in the regions where the solder connection abuts the head and conductor termination pads. The solder connection has excellent mechanical properties and reliability. The method avoids the creation of solder bumps during the wafer stage, and therefore the component processing cost is low, and the process is both fast and manufacturable.
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