Probe card assembly for high density integrated circuits

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United States of America Patent

PATENT NO 5828226
SERIAL NO

08746117

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A probe card assembly includes a probe card, an interposer and a probe array. The probe array includes a plurality of closely spaced pins, each pin includes a post and a beam, and each beam has a first end attached to the top of a post and a second end for contacting an integrated circuit. A bead on the second end of the beam assures that the free end of the beam will contact an IC first. For contacts on a grid, the beams extend diagonally relative to the rows and columns of the grid, enabling the beams to be longer. For contacts in a row on centers closer than the pins, two rows of pins straddle the contacts and the beams extend toward the contacts from opposite sides of the contacts. The probe array can be formed on the high density side of the interposer.

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Patent Owner(s)

Patent OwnerAddress
SV PROBE PTE LTD29 WOODLANDS INDUSTRIAL PARK E1 #04-01 NORTH TECH LOBBY 1 SINGAPORE 757716

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Armendariz, Norman J Phoenix, AZ 7 195
Bates, R Dennis Gilbert, AZ 2 225
Higgins, H Dan Chandler, AZ 6 565
Pandey, Rajiv Chandler, AZ 6 144

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