Heat dissipating fan/integrated circuit assemblies
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 27, 1998
Grant Date -
N/A
app pub date -
Mar 4, 1997
filing date -
Mar 3, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A heat dissipating fan/integrated circuit assembly includes a connector mounted on a printed circuit board and having two protrusions respectively projecting outwardly from two opposite sides thereof, an integrated circuit securely mounted to an upper side of the connector thereof, a fin mounted to an upper side of the integrated circuit, a fan device mounted on top of the fin and including two slots defined therein, and two engaging members respectively extending through the associated slots. Each engaging member includes an engaging hole defined in a lower end thereof for releasably engaging with the associated protrusion of the connector. An elastic member is mounted between each engaging member and the fan device to bias the associated engaging member away from the fan device, thereby providing a secure engagement between each protrusion and the associated engaging hole.
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