Multilayer printed circuit board and high-frequency circuit device using the same
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United States of America Patent
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Oct 27, 1998
Grant Date -
N/A
app pub date -
May 20, 1997
filing date -
Jul 25, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multilayer printed-circuit board includes at least one inner-layer signal line, first and second ground layers between which the inner-layer signal line is sandwiched via a frame member made of an insulating material in a thickness direction of the multilayer printed-circuit board, and metallic wall members which are provided on inner walls of slits formed in the frame member and extending along the inner-layer signal line. The first and second ground layers and the metallic wall members shielding the inner-layer signal line.
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