Liquid cooled heat sink for cooling electronic components
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United States of America Patent
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Nov 3, 1998
Issued Date -
N/A
app pub date -
Oct 24, 1995
filing date -
Dec 15, 1993
priority date (Note) -
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status (Latency Note)
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Abstract
A liquid cooled heat sink for cooling heat generating components. The heat sink has a base member with open ended channels formed in at least one surface thereof. The open ends of the channels have a span less than a span across a lower portion of the channels. A fluid conduit is disposed in said channels. The fluid conduit has an outer span greater than the span across the open ends of the channels and a flattened surface which is substantially coplanar with the surface of the heat sink base member having the channels therein.
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