Socket assembly for integrated circuit chip carrier package
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United States of America Patent
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Nov 3, 1998
Grant Date -
N/A
app pub date -
Nov 14, 1996
filing date -
Nov 14, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A socket for a ball grid array chip carrier package containing a die which is electrically interconnected. Individual spring elements in the socket are utilized for interconnecting each ball of the ball grid array. The individual spring elements provide upward pressure against individual sections of a substrate in direct contact with the balls of the ball grid array. The individual sections of the substrate are formed into individual beam members that are permitted to flex in response to pressure from the underlying spring elements.
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