Bear chip mounting printed circuit board and a method of manufacturing thereof by photoetching
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 3, 1998
Grant Date -
N/A
app pub date -
Jul 16, 1996
filing date -
Jul 17, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is a method of manufacturing bare chip mounting multi-layer printed circuit board in which arbitrary numbers of wiring circuit conductor layers and insulating layers are alternately stacked on one or both surfaces of a printed circuit board as a substrate, and a recessed portion with an upper opening capable of mounting and resin-encapsulating a bare chip part is formed on the surface of the printed circuit board, wherein at least the uppermost one of the insulating layers is made from a photosensitive resin, and the bare chip part mounting recessed portion is formed by photoetching the insulating layer made from the photosensitive resin. Since the bare chip part mounting recessed portion is formed by photoetching, the recessed portion can be easily and reliably formed. This results in a high product accuracy and allows a packaged part to be freely, additionally mounted even on the recessed portion.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully