Method of mounting electronic parts
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United States of America Patent
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Nov 10, 1998
Issued Date -
N/A
app pub date -
May 14, 1997
filing date -
Jun 6, 1995
priority date (Note) -
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Abstract
A method for manufacturing a leadless package type electronic part, the cost and the size of which can be reduced and which exhibits excellent reliability. The electronic part of a leadless package type includes a rectangular substrate having a plurality of external electrodes in the periphery thereof, an element part placed on the surface of the substrate while being electrically connected to the external electrodes, and molding resin for molding the element part onto the surface of the substrate, wherein the surface of the molding resin is formed to be flat, and each side surface of the molding resin is flush, or aligned, with a respective side surface of the substrate.
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