Contoured adhesive wafer for ostomy appliance
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United States of America Patent
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-
Nov 10, 1998
Issued Date -
N/A
app pub date -
Nov 3, 1997
filing date -
Apr 30, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An adhesive wafer for an ostomy pouch, and the combination of such a wafer and pouch, in which the adhesive layer of the wafer is composed of a hydrocolloid-containing skin barrier material and is contoured to provide a relatively thick body portion surrounded by a relatively thin peripheral portion, are disclosed. The wafer has a stoma-receiving opening, and the adhesive layer is of developed shape so that most, if not all, of the relatively thick body portion is located immediately below and to the sides of the stoma-receiving opening. The relatively thin peripheral portion of the adhesive layer is preferably embossed to provide a pattern of discrete, non-connecting depressions separated and isolated from each other by flat-top ridges dimensioned and arranged so that a skin surface engaged by said embossed surface primarily contacts only such ridges.
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Family
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