Material transfer apparatus and method of using the same
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United States of America Patent
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Nov 10, 1998
Issued Date -
N/A
app pub date -
Sep 3, 1997
filing date -
Jun 27, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A material (21) is transferred to an electronic component (32) using a transfer apparatus (10). The transfer apparatus (10) has pins (13) that pass through openings (19) in a cavity plate (16). The pins (13) and the openings (19) in the cavity plate (16) form cavities (20) that are filled with the material (21). The pins (13) are then extended from the cavity plate (16) to transfer the material (21) from the cavities (20) to the electronic component (32).
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