US Patent No: 5,834,565

Number of patents in Portfolio can not be more than 2000

Curable polyphenylene ether-thermosetting resin composition and process

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Importance

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Abstract

Polyphenylene ether-thermosetting resin compositions are provided that are useful as dielectrics, particularly printed circuit boards having improved processability, good solvent and solder resistance, as well as improved morphology as compared to other polyphenylene ether-thermosetting resin compositions. More specifically, the particular polyphenylene ether resin component of this invention has a molecular weight of less than about 3,000 number average in contrast to higher molecular weight polyphenylene ethers employed in other polyphenylene ether-thermosetting resin compositions for use in preparing printed circuit boards.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
SABIC INNOVATIVE PLASTICS IP B.V.BERGEN OP ZOOM2242

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tracy, James E Warsaw, OH 9 173
Yeager, Gary William Rexford, NY 110 479

Cited Art

Patent Info (Count) # Cites Year
 
ISOLA USA CORP. (4)
5,162,450 Curable dielectric polyphenylene ether-polyepoxide compositions 13 1990
5,096,771 Fibers impregnated with epoxy resin mixture, brominated bisphenol and polyphenylene ether 2 1990
5,108,842 Curable dielectric polyphenylene ether-polyepoxide compositions useful in printed circuit board production 8 1991
5,213,886 Curable dielectric polyphenylene ether-polyepoxide compositions 41 1992
 
MITSUBISHI GAS CHEMICAL COMPANY, INC. (2)
4,496,695 Curable resin composition 35 1982
4,920,164 Epoxy resin composition 18 1988
 
POLYCLAD LAMINATES, INC. (2)
4,853,423 Curable polyphenylene ether-polyepoxide compositions useful in printed circuit board production 20 1988
4,975,319 Printed circuit board from fibers impregnated with epoxy resin mixture, halogenated bisphenol and polyphenylene ether 17 1989
 
SABIC INNOVATIVE PLASTICS IP B.V. (2)
5,001,010 Curable polyphenylene ether-polyepoxide compositions from melt processed polyphenylene ethers, and laminates prepared therefrom 17 1988
5,141,791 Curable polyphenylene ether-polyepoxide compositions from melt processed polyphenylene ethers, and laminates prepared therefrom 13 1990
 
CIBA-GEIGY CORPORATION (1)
4,757,117 Powder coating compositions 18 1987
 
FAUSTEL, INC. (1)
5,478,599 Process for resin impregnation of a fibrous substrate 7 1995
 
GENERAL ELECTRIC COMPANY (1)
5,043,367 Curable dielectric polyphenylene ether-polyepoxide compositions useful in printed circuit board production 23 1988
 
HUELS AKTIENGESELLSCHAFT (1)
4,579,992 Production of 3,3- and 2,3-dimethylbutenes, 2,3-dimethylbutadiene and/or glycol or polyglycol N-alkyl-3,3- and -2,3-dimethylbutyl ether 23 1984
 
MATSUSHITA ELECTRIC WORKS, LTD. (1)
5,124,415 Method of preparing polyphenylene oxide composition and laminates using such compositions 6 1989
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
4,677,144 Epoxy resin composition 5 1986
 
ROUSSEL UCLAF (1)
5,078,657 Belt tensioner 4 1990
 
SHARP KABUSHIKI KAISHA (1)
4,695,745 Monolithic semiconductor integrated circuit with programmable elements for minimizing deviation of threshold value 11 1984
 
UNION CARBIDE CORPORATION (1)
4,661,559 Impact resistant matrix resins for advanced composites 33 1985

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
SABIC INNOVATIVE PLASTICS IP B.V. (46)
6,306,978 Capping of polyphenylene ether resin 26 1999
6,387,990 Curable epoxy resin compositions with brominated triazine flame retardants 9 1999
6,352,782 Poly(phenylene ether)-polyvinyl thermosetting resin 55 1999
6,906,120 Poly(arylene ether) adhesive compositions 7 2000
6,306,963 Thermosetting resins and laminates 34 2000
6,576,718 Powder coating of thermosetting resin(s) and poly(phenylene ethers(s)) 10 2000
6,521,703 Curable resin composition, method for the preparation thereof, and articles derived thereform 34 2001
6,878,781 Poly(arylene ether)-containing thermoset composition in powder form, method for the preparation thereof, and articles derived therefrom 11 2001
6,593,391 Abrasive-filled thermoset composition and its preparation, and abrasive-filled articles and their preparation 10 2001
7,022,777 Moldable poly(arylene ether) thermosetting compositions, methods, and articles 3 2001
6,627,704 Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom 37 2001
6,617,398 Poly (phenylene ether)--polyvinyl thermosetting resin 42 2001
6,905,637 Electrically conductive thermoset composition, method for the preparation thereof, and articles derived therefrom 13 2001
6,469,124 Functionalized polyphenylene ether resins and curable compositions comprising them 25 2001
6,774,160 Curable epoxy resin compositions and the cured residues thereof 3 2002
6,770,691 Curable epoxy resin compositions and the cured residues thereof 0 2002
6,767,639 Cured epoxy resin compositions with brominated triazine flame retardants, and laminates comprising them 0 2002
6,627,708 Compositions comprising functionalized polyphenylene ether resins 19 2002
6,878,782 Thermoset composition, method, and article 8 2002
6,812,276 Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom 36 2002
6,770,107 Abrasive-filled thermoset composition and its preparation, and abrasive-filled articles and their preparation 3 2003
6,784,260 Powder coating of thermosetting resin(s), polyphenylene ether(s) and curing agent(s) 3 2003
7,205,035 Thermoset composition, method, and article 0 2003
6,780,959 Compositions comprising functionalized polyphenylene ether resins 4 2003
7,235,192 Capped poly(arylene ether) composition and method 7 2003
7,226,980 Thermoset composition, method for the preparation thereof, and articles prepared therefrom 0 2003
7,211,639 Composition comprising functionalized poly(arylene ether) and ethylene-alkyl (meth)acrylate copolymer, method for the preparation thereof, and articles prepared therefrom 5 2003
7,148,296 Capped poly(arylene ether) composition and process 7 2003
7,101,923 Flame-retardant thermoset composition, method, and article 5 2003
7,067,595 Poly (arylene ether) composition and method 10 2003
6,897,282 Compositions comprising functionalized polyphenylene ether resins 16 2003
7,250,477 Thermoset composite composition, method, and article 5 2003
7,329,708 Functionalized poly(arylene ether) composition and method 9 2004
7,119,136 Flame-retardant thermoset composition, method, and article 7 2004
7,354,533 Electrically conductive thermoset composition, method for the preparation thereof, and articles derived therefrom 0 2004
7,199,213 Thermoset composition, method for the preparation thereof, and articles prepared therefrom 0 2005
7,090,920 Poly(arylene ether) adhesive compositions 2 2005
7,429,800 Molding composition and method, and molded article 0 2005
7,378,455 Molding composition and method, and molded article 4 2005
7,655,734 Capped poly(arylene ether) composition and process 2 2006
7,655,278 Composite-forming method, composites formed thereby, and printed circuit boards incorporating them 0 2007
8,192,649 Capped poly(arylene ether) composition and method 0 2007
7,393,895 Forming concentrate of poly(arylene ether), thermosetting resin and compatibilizer 0 2007
7,781,537 Functionalized poly(arylene ether) composition and method 0 2007
8,053,077 Composite-forming method, composites formed thereby, and printed circuit boards incorporating them 0 2009
8,163,847 Capped poly(arylene ether) composition and process 0 2009
 
ASAHI KASEI CHEMICALS CORPORATION (4)
7,341,783 Functionalized polyphenylene ether 1 2002
7,439,310 Polyphenylene ether modified by reaction with cresol novolac epoxy resin 0 2006
7,858,726 Process for producing low-molecular polyphenylene ether 1 2007
7,527,863 Functionalized polyphenylene ether 0 2008
 
IBIDEN CO., LTD. (2)
7,916,492 Multilayered printed circuit board 3 2000
7,910,836 Multilayered printed circuit board, solder resist composition, and semiconductor device 0 2007
 
CHOONGWAE PHARMA CORPORATION (1)
6,558,783 Thermosetting polyphenylene ether resin composition, cured resin composition obtained therefrom, and laminated structure 7 2000
 
HITACHI CHEMICAL COMPANY, LTD. (1)
6,465,083 METHOD OF MAKING VARNISH OF MODIFIED CYANATE ESTER GROUP CURABLE RESIN COMPOSITION, AND PREPREG, METAL CLAD LAMINATED BOARD, FILM, PRINTED CIRCUIT BOARD, AND MULTILAYERED CIRCUIT BOARD USING THE COMPOSITION 1 2000
 
SUMITOMO CHEMICAL COMPANY, LIMITED (1)
6,670,042 Insulating film 2 2002
 
UNIPLUS ELECTRONICS CO., LTD. (1)
7,101,933 Process for producing high speed transmitting dielectric material 0 2003