Pin array set-up device
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United States of America Patent
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Nov 10, 1998
Issued Date -
N/A
app pub date -
Dec 16, 1996
filing date -
Jul 20, 1994
priority date (Note) -
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Abstract
An integrated circuit probing method and apparatus therefor. The apparatus includes a main system controller coupled to a network interface, graphic user interface, and equipment interface. A high speed bus connects the main system controller to a group of subsystems. The subsystems includes subsystems such as input cassettes, input frame handing, frame to align, die align, die probing, die bin and die output, output cassettes subsystem, among others. The integrated circuit probing apparatus allows for probing of each individual die through the die probing subsystem, typically a high speed subsystem.
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