Integrated circuit test head
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 10, 1998
Issued Date -
N/A
app pub date -
Oct 30, 1997
filing date -
Oct 19, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An integrated circuit test head assembly includes a group of circuit modules arranged in a circle, with the heat sinks carried by each of the modules located on the outside of the circle. The circuit modules are contained within a test head housing. Conductive pins extend downwardly from each of the modules and contact a probe card directly, without the need for an adapter. The circuit boards are cooled by flowing a cooling medium, typically a gas, around the outside of the circle of modules, so that all of the heat sinks are evenly cooled.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully