Packed semiconductor device with wrap around external leads
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United States of America Patent
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-
Nov 10, 1998
Grant Date -
N/A
app pub date -
Oct 24, 1996
filing date -
Mar 27, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device with reduced thickness, improved heat radiation, and a stacked structure. Molded resin covers an IC chip wire and part of a die pad. The die pad is exposed from the molded resin. An external lead in the same plane as the exposed surface of the die pad extends to a side of the resin opposite the die pad and along the molded resin. This structure allows a reduction in thickness of the semiconductor device, the exposed die pad improves heat radiation, and the external lead on upper and lower surfaces of the resin allows the semiconductor devices to be stacked.
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