Laser drilling holes in components by combined percussion and trepan drilling
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United States of America Patent
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Nov 17, 1998
Issued Date -
N/A
app pub date -
Jan 16, 1998
filing date -
Jan 16, 1998
priority date (Note) -
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Abstract
A process is provided for laser drilling relatively large and deep holes in superalloy components by percussion laser drilling a central hole through the component to a diameter less than the predetermined diameter, then trepanning laser drilling around the central hole to expand the diameter of the hole to the predetermined diameter. The steps are repeated to deepen the hole.
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