Dual blade robot
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United States of America Patent
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Nov 17, 1998
Grant Date -
N/A
app pub date -
Nov 18, 1996
filing date -
Nov 18, 1996
priority date (Note) -
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Abstract
A multi-blade wafer handling device is provided to concurrently move two or more wafers through a vacuum processing system. The wafer handling device includes two motors magnetically coupled into a transfer chamber to move an arm assembly connected to a dual blade assembly. The preferred wafer handling device includes a first rotating member operated by the first motor, a second rotating member operated by the second motor, a blade assembly having at least first and second wafer blades wherein the wafer blades are co-planar, and an arm assembly connecting the first and second rotating members to the blade assembly.
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