Integral rigid chip test probe
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United States of America Patent
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Nov 17, 1998
Issued Date -
N/A
app pub date -
Nov 8, 1996
filing date -
Apr 7, 1994
priority date (Note) -
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Abstract
The present invention is directed to probe structures for testing of electrical interconnections to integrated circuit devices and other electronic components and particularly to testing integrated circuit devices with high density area array solder ball interconnections. The probe structure is formed from a substrate having a surface having at least one electrical contact location which has a perimeter which is raised above the surface and a location within the boundaries of said perimeter which is raised above the surface.
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