Semiconductor interconnect having test structures for evaluating electrical characteristics of the interconnect
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 17, 1998
Grant Date -
N/A
app pub date -
May 1, 1996
filing date -
May 1, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An interconnect for a semiconductor die includes integrally formed test structures for evaluating various electrical characteristics of the interconnect. The test structures can include Kelvin structures, van der Pauw structures, resistors, capacitors, contact chains, via chains, serpentine test structures, and antenna test structures. Among the electrical characteristics that can be evaluated are the resistivity of contact member, conductor and substrate components of the interconnect, contact resistance between the contact members and conductors and capacitance of the contact members and conductors with respect to the substrate.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully