Metallized laminate material having ordered distribution of conductive through holes
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United States of America Patent
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Nov 24, 1998
Grant Date -
N/A
app pub date -
Jun 24, 1994
filing date -
Jun 24, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A metallized laminate material for the manufacture of high performance, high density printed wiring boards and the like includes an ordered distribution of via holes electrically interconnecting opposing conductive layers on a dielectric polymeric film substrate. Furthermore, opposing photoresist layers substantially cover the conductive layers and vias. The conductive material in the conductive layers and the vias is bonded adhesivelessly to the substrate to provide a high degree of delamination resistance. The production of metallized laminate material is preferably carried out in a roll-to-roll process suitable for high volume, low cost production. In use, an end user may manufacture customized printed wiring boards in small volume runs from the laminate material with a reduced amount of equipment, expertise and cost.
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