US Patent No: 5,841,099

Number of patents in Portfolio can not be more than 2000

Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets

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Abstract

The output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light (62) for forming vias (72, 74) in targets (40) having metallic layers (64,68) and a dielectric layer (66). The invention employs a first laser output of high power density to ablate the metallic layer and a second laser output of a lower power density to ablate the dielectric layer. The parameters of the output pulses (62) are selected to facilitate substantially clean, sequential drilling or via formation. These parameters typically include at least two of the following criteria: power density first above and then below the ablation threshold of the conductor, wavelength less than 400 nm, a temporal pulse width shorter than about 100 nanoseconds, and a repetition rate of greater than about one kilohertz. The ability to generate ultraviolet light output pulses at two power densities facilitates the formation of depthwise self-limiting blind vias in multilayer targets, such as a target composed of a layer dielectric material covered on either surface by a layer of metal.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
ELECTRO SCIENTIFIC INDUSTRIES, INC.PORTLAND, OR279

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Larson, Bonnie A Hillsboro, OR 3 114
Owen, Mark D Beaverton, OR 30 533
Puymbroeck, Jozef Van Oostkamp, BE 5 117

Cited Art

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (7)
4,414,059 Far UV patterning of resist materials 135 1982
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5,168,454 Formation of high quality patterns for substrates and apparatus therefor 47 1989
5,153,408 Method and structure for repairing electrical lines 21 1990
5,194,713 Removal of excimer laser debris using carbon dioxide laser 23 1991
5,316,803 Method for forming electrical interconnections in laminated vias 12 1992
5,536,579 Design of high density structures with laser etch stop 10 1994
 
CANON KABUSHIKI KAISHA (2)
5,073,687 Method and apparatus for working print board by laser 41 1990
5,063,280 Method and apparatus for forming holes into printed circuit board 52 1990
 
ELECTRO SCIENTIFIC INDUSTRIES, INC. (2)
4,930,901 Method of and apparatus for modulating a laser beam 47 1989
5,593,606 Ultraviolet laser system and method for forming vias in multi-layered targets 124 1994
 
UNISYS CORPORATION (2)
4,832,788 Method of fabricating a tapered via hole in polyimide 32 1987
5,087,396 Method of forming holes in unfired ceramic layers of integrated circuit packages 16 1991
 
AT & T TECHNOLOGIES, INC., (1)
4,258,468 Forming vias through multilayer circuit boards 45 1978
 
AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD. (1)
5,066,357 Method for making flexible circuit card with laser-contoured vias and machined capacitors 106 1990
 
E. I. DU PONT DE NEMOURS AND COMPANY (1)
5,293,025 Method for forming vias in multilayer circuits 86 1991
 
GORE ENTERPRISE HOLDINGS, INC. (1)
5,731,047 Multiple frequency processing to improve electrical resistivity of blind micro-vias 31 1996
 
HITACHI VIA MECHANICS, LTD. (1)
5,010,232 Method of and apparatus for perforating printed circuit board 24 1990
 
ISOLA USA CORP. (1)
4,789,770 Controlled depth laser drilling system 69 1987
 
LOCKHEED MARTIN CORPORATION (1)
4,894,115 Laser beam scanning method for forming via holes in polymer materials 119 1989
 
SAMSUNG ELECTRONICS CO., LTD. (1)
5,227,013 Forming via holes in a multilevel substrate in a single step 64 1991
 
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. (1)
4,970,369 Electronic device manufacturing methods 21 1989
 
SIEMENS NIXDORF INFORMATIONSSYSTEME AG (1)
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TEIJIN LIMITED (1)
5,378,869 Method for forming an integrated circuit package with via interconnection 29 1993
 
VISICOM MANUFACTURING CORPORATION (1)
5,108,785 Via formation method for multilayer interconnect board 46 1989
 
WORLD PROPERTIES, INC. (1)
4,915,981 Method of laser drilling fluoropolymer materials 73 1988
 
XONICS TECHNOLOGY, INC. (1)
4,684,437 Selective metal etching in metal/polymer structures 24 1985

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
ELECTRO SCIENTIFIC INDUSTRIES, INC. (26)
6,433,301 Beam shaping and projection imaging with solid state UV Gaussian beam to form vias 55 2000
6,430,465 Abbe error correction system and method 29 2001
6,407,363 Laser system and method for single press micromachining of multilayer workpieces 73 2001
7,157,038 Ultraviolet laser ablative patterning of microstructures in semiconductors 6 2001
6,806,440 Quasi-CW diode pumped, solid-state UV laser system and method employing same 4 2002
6,784,399 Micromachining with high-energy, intra-cavity Q-switched CO2 laser pulses 18 2002
6,676,878 Laser segmented cutting 32 2002
6,781,090 Quasi-CW diode-pumped, solid-state harmonic laser system and method employing same 6 2002
7,671,295 Processing a memory link with a set of at least two laser pulses 3 2002
6,791,060 Beam shaping and projection imaging with solid state UV gaussian beam to form vias 29 2002
6,706,998 Simulated laser spot enlargement 14 2003
7,057,133 Methods of drilling through-holes in homogenous and non-homogenous substrates 8 2004
7,139,294 Multi-output harmonic laser and methods employing same 0 2004
7,482,551 Processing a memory link with a set of at least two laser pulses 3 2005
RE43400 Laser segmented cutting, multi-step cutting, or both 0 2006
8,198,566 Laser processing of workpieces containing low-k dielectric material 0 2006
7,605,343 Micromachining with short-pulsed, solid-state UV laser 3 2006
8,116,341 Multiple laser wavelength and pulse width process drilling 0 2007
7,982,160 Photonic clock stabilized laser comb processing 1 2008
8,173,931 Automatic recipe management for laser processing a work piece 0 2008
8,178,818 Photonic milling using dynamic beam arrays 0 2008
RE43487 Laser segmented cutting 1 2009
RE43605 Laser segmented cutting, multi-step cutting, or both 0 2009
8,415,586 Method for increasing throughput of solder mask removal by minimizing the number of cleaning pulses 0 2009
8,338,746 Method for processing a memory link with a set of at least two laser pulses 0 2010
8,358,671 Photonic clock stabilized laser comb processing 0 2011
 
GSI GROUP CORPORATION (13)
8,217,304 Methods and systems for thermal-based laser processing a multi-material device 0 2002
7,027,155 Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure 23 2002
6,972,268 Methods and systems for processing a device, methods and systems for modeling same and the device 42 2002
7,723,642 Laser-based system for memory link processing with picosecond lasers 0 2003
7,192,846 Methods and systems for processing a device, methods and systems for modeling same and the device 14 2005
8,193,468 Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure 0 2005
7,394,476 Methods and systems for thermal-based laser processing a multi-material device 14 2006
8,084,706 System and method for laser processing at non-constant velocities 1 2006
7,955,905 Methods and systems for thermal-based laser processing a multi-material device 0 2006
7,838,794 Laser-based method and system for removing one or more target link structures 0 2007
7,955,906 Methods and systems for thermal-based laser processing a multi-material device 2 2008
7,871,903 Method and system for high-speed, precise micromachining an array of devices 2 2009
8,253,066 Laser-based method and system for removing one or more target link structures 0 2010
 
HITACHI VIA MECHANICS, LTD. (9)
6,310,701 Method and apparatus for ablating high-density array of vias or indentation in surface of object 9 2000
6,420,675 Control system for ablating high-density array of vias or indentation in surface of object 11 2000
6,256,121 Apparatus for ablating high-density array of vias or indentation in surface of object 36 2000
6,479,788 Method and apparatus of making a hole in a printed circuit board 18 2000
6,531,677 Method and apparatus for drilling printed wiring boards 9 2001
6,610,960 Method for drilling micro-holes with a laser beam 13 2002
6,713,719 Method and device for laser drilling laminates 9 2002
6,653,593 Control system for ablating high-density array of vias or indentation in surface of object 5 2002
6,781,092 Method for drilling holes in a substrate 3 2003
 
ORBOTECH LTD. (9)
6,689,985 Laser drill for use in electrical circuit fabrication 19 2001
7,642,484 Multiple beam micro-machining system and method 1 2002
7,633,036 Micro-machining system employing a two stage beam steering mechanism 1 2002
7,176,409 Multiple beam micromachining system for removing at least two different layers of a substrate 2 2002
6,809,290 Laser energy delivery system outputting beams having a selectable energy 5 2002
7,629,555 Multiple beam micro-machining system and method 0 2003
7,521,651 Multiple beam micro-machining system and method 0 2003
7,078,650 Micro-machining employing multiple independently focused and independently steered beams 3 2003
7,947,922 Multiple beam micro-machining system and method 0 2009
 
IBIDEN CO., LTD. (5)
7,462,801 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board 1 1997
7,732,732 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board 1 2004
7,456,372 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board 1 2004
7,667,160 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board 0 2006
7,462,802 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board 1 2006
 
INDENTIFICATION DYNAMICS, LLC (4)
6,886,284 Firearm microstamping and micromarking insert for stamping a firearm identification code and serial number into cartridge shell casings and projectiles 6 2002
6,833,911 Method and apparatus for reading firearm microstamping 3 2003
7,111,423 Method and apparatus for reading firearm microstamping 0 2003
7,204,419 Method and apparatus for reading firearm microstamping 6 2003
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (3)
6,509,546 Laser excision of laminate chip carriers 19 2000
6,810,583 Coupling of conductive vias to complex power-signal substructures 8 2001
7,500,306 Coupling of conductive vias to complex power-signal substructures 2 2004
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (3)
6,546,624 Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board 1 2000
6,946,091 Laser drilling 1 2001
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DATA STORAGE INSTITUTE (2)
6,838,637 Method and apparatus for deflashing of integrated circuit packages 1 2002
7,170,029 Method and apparatus for deflashing of integrated circuit packages 2 2004
 
DISCO CORPORATION (2)
8,258,428 Laser beam processing machine 0 2007
7,935,910 Method of laser drilling vias 0 2008
 
INVENSAS CORPORATION (2)
6,931,723 Organic dielectric electronic interconnect structures and method for making 9 2000
7,253,512 Organic dielectric electronic interconnect structures and method for making 0 2005
 
ROUND ROCK RESEARCH, LLC (2)
6,710,284 Laser marking techniques for bare semiconductor die 5 1999
6,680,458 Laser marking techniques for bare semiconductor die 1 2001
 
SIEMENS AKTIENGESELLSCHAFT (2)
7,816,625 Method for the production of a hole and device 1 2004
8,237,082 Method for producing a hole 0 2007
 
SUMITOMO HEAVY INDUSTRIES, LTD. (2)
6,580,055 Laser processing apparatus and method 25 2001
6,710,289 Laser processing apparatus and method 12 2003
 
THE GSI GROUP, INC. (2)
6,657,159 Method for laser drilling 8 2002
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ALSTOM TECHNOLOGY LTD (1)
7,329,832 Automated adaptive machining of obstructed passages 1 2006
 
ANVIK CORPORATION (1)
6,624,382 Configured-hole high-speed drilling system for micro-via pattern formation, and resulting structure 3 2001
 
COHERENT GMBH (1)
6,795,456 157 nm laser system and method for multi-layer semiconductor failure analysis 9 2000
 
COHERENT LAMBDA PHYSIK GMBH (1)
6,487,229 Beam delivery system for molecular fluorine (F2) laser 2 2001
 
COMMISSARIAT A L'ENERGIE ATOMIQUE (1)
6,320,367 Device for analyzing a single pulse with variable step 3 2000
 
CORETEK, INC. (1)
6,775,316 Method and apparatus for integrating a vertical cavity surface emitting laser with a optical amplifier 3 2002
 
EFFICERE, LLC (1)
6,878,901 Laser micromachining and electrical structures formed thereby 2 2004
 
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7,027,467 Fiber laser 7 2001
 
EXITECH LIMITED (1)
6,576,869 Method and apparatus for drilling microvia holes in electrical circuit interconnection packages 7 2000
 
GSI LUMONICS CORPORATION (1)
7,382,389 Methods and systems for thermal-based laser processing a multi-material device 5 2006
 
HAMAMATSU PHOTONICS K.K. (1)
6,950,449 Passively Q-switched laser 0 2002
 
HGST NETHERLANDS B.V. (1)
RE39001 Laser cutting method for forming magnetic recording head sliders 3 2002
 
IMRA AMERICA, INC. (1)
8,158,493 Laser-based material processing methods and systems 0 2009
 
JDS UNIPHASE CORPORATION (1)
7,352,784 Laser burst boosting method and apparatus 1 2004
 
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6,490,305 Beam delivery system for molecular fluorine (F2) laser 4 2001
 
LAWRENCE LIVERMORE NATIONAL SECURITY, LLC (1)
6,864,459 High precision, rapid laser hole drilling 7 2001
 
LOCKHEED MARTIN CORPORATION (1)
6,541,731 Use of multiple laser sources for rapid, flexible machining and production of vias in multi-layered substrates 68 2001
 
MERCHANTBANC VENTURE PARTNERS, LIMITED PARTNERSHIP (1)
6,501,045 Method and apparatus for controlling the taper angle of the walls of laser machined features 4 2000
 
MICROSOUND SYSTEMS, INC. (1)
6,354,000 Method of creating an electrical interconnect device bearing an array of electrical contact pads 1 1999
 
NATIONAL RESEARCH COUNCIL OF CANADA (1)
6,719,916 Multilayer microstructures and laser based method for precision and reduced damage patterning of such structures 6 2002
 
NIPPON MEKTRON, LTD. (1)
6,523,257 Method for forming fine through hole conduction portion of circuit board 0 2001
 
OPTICAL ANALYTICS, INC. (1)
7,759,607 Method of direct Coulomb explosion in laser ablation of semiconductor structures 2 2007
 
ORBTECH LTD. (1)
7,206,120 Dynamic beam splitter outputting a selectable number of beams 7 2003
 
PRECO, INC. (1)
6,540,952 Laser ablation of multiple layers 0 2002
 
SOLYNDRA LLC (1)
7,879,685 System and method for creating electric isolation between layers comprising solar cells 0 2007
 
WESTAR PHOTONICS (1)
6,696,008 Maskless laser beam patterning ablation of multilayered structures with continuous monitoring of ablation 54 2001
 
OTHER [CHECK PATENT PROFILE FOR ASSIGNMENT INFORMATION] (2)
7,514,648 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board 0 2006
8,444,906 Method of cutting substrate 0 2010