US Patent No: 5,841,099

Number of patents in Portfolio can not be more than 2000

Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets

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Abstract

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The output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light (62) for forming vias (72, 74) in targets (40) having metallic layers (64,68) and a dielectric layer (66). The invention employs a first laser output of high power density to ablate the metallic layer and a second laser output of a lower power density to ablate the dielectric layer. The parameters of the output pulses (62) are selected to facilitate substantially clean, sequential drilling or via formation. These parameters typically include at least two of the following criteria: power density first above and then below the ablation threshold of the conductor, wavelength less than 400 nm, a temporal pulse width shorter than about 100 nanoseconds, and a repetition rate of greater than about one kilohertz. The ability to generate ultraviolet light output pulses at two power densities facilitates the formation of depthwise self-limiting blind vias in multilayer targets, such as a target composed of a layer dielectric material covered on either surface by a layer of metal.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
ELECTRO SCIENTIFIC INDUSTRIES, INC.PORTLAND, OR429

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Larson, Bonnie A Hillsboro, OR 5 119
Owen, Mark D Beaverton, OR 42 638
Puymbroeck, Jozef Van Oostkamp, BE 6 122

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (7)
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5,153,408 Method and structure for repairing electrical lines 21 1990
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5,316,803 Method for forming electrical interconnections in laminated vias 13 1992
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CANON KABUSHIKI KAISHA (2)
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ELECTRO SCIENTIFIC INDUSTRIES, INC. (2)
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5,593,606 Ultraviolet laser system and method for forming vias in multi-layered targets 142 1994
 
UNISYS CORPORATION (2)
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5,066,357 Method for making flexible circuit card with laser-contoured vias and machined capacitors 107 1990
 
E. I. DU PONT DE NEMOURS AND COMPANY (1)
5,293,025 Method for forming vias in multilayer circuits 90 1991
 
GORE ENTERPRISE HOLDINGS, INC. (1)
5,731,047 Multiple frequency processing to improve electrical resistivity of blind micro-vias 34 1996
 
HITACHI VIA MECHANICS, LTD. (1)
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ISOLA USA CORP. (1)
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LOCKHEED MARTIN CORPORATION (1)
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SAMSUNG ELECTRONICS CO., LTD. (1)
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SIEMENS NIXDORF INFORMATIONSSYSTEME AG (1)
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TEIJIN LIMITED (1)
5,378,869 Method for forming an integrated circuit package with via interconnection 29 1993
 
VISICOM MANUFACTURING CORPORATION (1)
5,108,785 Via formation method for multilayer interconnect board 46 1989
 
WORLD PROPERTIES, INC. (1)
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XONICS TECHNOLOGY, INC. (1)
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Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
ELECTRO SCIENTIFIC INDUSTRIES, INC. (42)
6,433,301 Beam shaping and projection imaging with solid state UV Gaussian beam to form vias 63 2000
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6,407,363 Laser system and method for single press micromachining of multilayer workpieces 99 2001
7,157,038 Ultraviolet laser ablative patterning of microstructures in semiconductors 11 2001
6,806,440 Quasi-CW diode pumped, solid-state UV laser system and method employing same 5 2002
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6,972,268 Methods and systems for processing a device, methods and systems for modeling same and the device 43 2002
6,784,399 Micromachining with high-energy, intra-cavity Q-switched CO2 laser pulses 21 2002
6,676,878 Laser segmented cutting 54 2002
6,657,159 Method for laser drilling 9 2002
6,781,090 Quasi-CW diode-pumped, solid-state harmonic laser system and method employing same 7 2002
7,671,295 Processing a memory link with a set of at least two laser pulses 5 2002
6,791,060 Beam shaping and projection imaging with solid state UV gaussian beam to form vias 38 2002
6,706,998 Simulated laser spot enlargement 27 2003
7,723,642 Laser-based system for memory link processing with picosecond lasers 1 2003
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7,192,846 Methods and systems for processing a device, methods and systems for modeling same and the device 15 2005
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7,482,551 Processing a memory link with a set of at least two laser pulses 4 2005
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RE43400 Laser segmented cutting, multi-step cutting, or both 1 2006
7,394,476 Methods and systems for thermal-based laser processing a multi-material device 15 2006
8,198,566 Laser processing of workpieces containing low-k dielectric material 0 2006
7,605,343 Micromachining with short-pulsed, solid-state UV laser 6 2006
8,084,706 System and method for laser processing at non-constant velocities 2 2006
7,955,905 Methods and systems for thermal-based laser processing a multi-material device 0 2006
7,838,794 Laser-based method and system for removing one or more target link structures 0 2007
8,116,341 Multiple laser wavelength and pulse width process drilling 0 2007
8,710,402 Method of and apparatus for laser drilling holes with improved taper 0 2007
7,982,160 Photonic clock stabilized laser comb processing 1 2008
8,173,931 Automatic recipe management for laser processing a work piece 0 2008
7,955,906 Methods and systems for thermal-based laser processing a multi-material device 3 2008
8,178,818 Photonic milling using dynamic beam arrays 0 2008
RE43487 Laser segmented cutting 2 2009
RE43605 Laser segmented cutting, multi-step cutting, or both 0 2009
8,415,586 Method for increasing throughput of solder mask removal by minimizing the number of cleaning pulses 0 2009
7,871,903 Method and system for high-speed, precise micromachining an array of devices 2 2009
8,338,746 Method for processing a memory link with a set of at least two laser pulses 1 2010
8,253,066 Laser-based method and system for removing one or more target link structures 0 2010
8,358,671 Photonic clock stabilized laser comb processing 0 2011
 
ORBOTECH LTD. (9)
6,689,985 Laser drill for use in electrical circuit fabrication 19 2001
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7,633,036 Micro-machining system employing a two stage beam steering mechanism 1 2002
7,176,409 Multiple beam micromachining system for removing at least two different layers of a substrate 3 2002
6,809,290 Laser energy delivery system outputting beams having a selectable energy 6 2002
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7,521,651 Multiple beam micro-machining system and method 0 2003
7,078,650 Micro-machining employing multiple independently focused and independently steered beams 3 2003
7,947,922 Multiple beam micro-machining system and method 0 2009
 
HITACHI VIA MECHANICS, LTD. (8)
6,310,701 Method and apparatus for ablating high-density array of vias or indentation in surface of object 10 2000
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6,479,788 Method and apparatus of making a hole in a printed circuit board 24 2000
6,531,677 Method and apparatus for drilling printed wiring boards 10 2001
6,610,960 Method for drilling micro-holes with a laser beam 20 2002
6,713,719 Method and device for laser drilling laminates 10 2002
6,653,593 Control system for ablating high-density array of vias or indentation in surface of object 5 2002
 
IBIDEN CO., LTD. (5)
7,462,801 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board 2 1997
7,732,732 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board 1 2004
7,456,372 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board 2 2004
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7,462,802 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board 1 2006
 
INDENTIFICATION DYNAMICS, LLC (4)
6,886,284 Firearm microstamping and micromarking insert for stamping a firearm identification code and serial number into cartridge shell casings and projectiles 6 2002
6,833,911 Method and apparatus for reading firearm microstamping 3 2003
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7,204,419 Method and apparatus for reading firearm microstamping 7 2003
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (3)
6,509,546 Laser excision of laminate chip carriers 23 2000
6,810,583 Coupling of conductive vias to complex power-signal substructures 8 2001
7,500,306 Coupling of conductive vias to complex power-signal substructures 2 2004
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (3)
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6,946,091 Laser drilling 2 2001
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COHERENT GMBH (2)
6,795,456 157 nm laser system and method for multi-layer semiconductor failure analysis 14 2000
6,487,229 Beam delivery system for molecular fluorine (F2) laser 2 2001
 
DATA STORAGE INSTITUTE (2)
6,838,637 Method and apparatus for deflashing of integrated circuit packages 1 2002
7,170,029 Method and apparatus for deflashing of integrated circuit packages 2 2004
 
DISCO CORPORATION (2)
8,258,428 Laser beam processing machine 1 2007
7,935,910 Method of laser drilling vias 0 2008
 
IMRA AMERICA, INC. (2)
8,158,493 Laser-based material processing methods and systems 2 2009
8,785,813 Laser-based material processing methods and systems 0 2012
 
INVENSAS CORPORATION (2)
6,931,723 Organic dielectric electronic interconnect structures and method for making 9 2000
7,253,512 Organic dielectric electronic interconnect structures and method for making 0 2005
 
ROUND ROCK RESEARCH, LLC (2)
6,710,284 Laser marking techniques for bare semiconductor die 5 1999
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SIEMENS AKTIENGESELLSCHAFT (2)
7,816,625 Method for the production of a hole and device 3 2004
8,237,082 Method for producing a hole 0 2007
 
SUMITOMO HEAVY INDUSTRIES, LTD. (2)
6,580,055 Laser processing apparatus and method 26 2001
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ALSTOM TECHNOLOGY LTD (1)
7,329,832 Automated adaptive machining of obstructed passages 2 2006
 
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6,624,382 Configured-hole high-speed drilling system for micro-via pattern formation, and resulting structure 5 2001
 
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7,027,467 Fiber laser 11 2001
 
EXITECH LIMITED (1)
6,576,869 Method and apparatus for drilling microvia holes in electrical circuit interconnection packages 11 2000
 
GSI LUMONICS CORPORATION (1)
7,382,389 Methods and systems for thermal-based laser processing a multi-material device 8 2006
 
HAMAMATSU PHOTONICS K.K. (1)
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RE39001 Laser cutting method for forming magnetic recording head sliders 8 2002
 
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7,352,784 Laser burst boosting method and apparatus 1 2004
 
LAMBDA PHYSIK AG (1)
6,490,305 Beam delivery system for molecular fluorine (F2) laser 4 2001
 
LAWRENCE LIVERMORE NATIONAL SECURITY, LLC (1)
6,864,459 High precision, rapid laser hole drilling 9 2001
 
LOCKHEED MARTIN CORPORATION (1)
6,541,731 Use of multiple laser sources for rapid, flexible machining and production of vias in multi-layered substrates 70 2001
 
MERCHANTBANC VENTURE PARTNERS, LIMITED PARTNERSHIP (1)
6,501,045 Method and apparatus for controlling the taper angle of the walls of laser machined features 4 2000
 
MICROSOUND SYSTEMS, INC. (1)
6,354,000 Method of creating an electrical interconnect device bearing an array of electrical contact pads 1 1999
 
NATIONAL RESEARCH COUNCIL OF CANADA (1)
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OPTICAL ANALYTICS, INC. (1)
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Orbtech Ltd. (1)
7,206,120 Dynamic beam splitter outputting a selectable number of beams 7 2003
 
PLASTIC LOGIC LIMITED (1)
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PRECO, INC. (1)
6,540,952 Laser ablation of multiple layers 1 2002
 
QUALCOMM MEMS TECHNOLOGIES, INC. (1)
8,724,832 Piezoelectric microphone fabricated on glass 0 2011
 
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8,444,906 Method of cutting substrate 1 2010
 
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WESTAR PHOTONICS (1)
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Other [Check patent profile for assignment information] (1)
7,514,648 Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring board 0 2006

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