Method of fabricating bubblejet print devices using semiconductor fabrication techniques
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United States of America Patent
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Nov 24, 1998
Issued Date -
N/A
app pub date -
Sep 15, 1994
filing date -
Jan 30, 1991
priority date (Note) -
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Abstract
A method of fabricating bubblejet print devices uses semiconductor fabrication techniques, and this method involves forming a heater means and an electrical connection to the heater means on a substrate, and forming a passageway through the substrate. A given end of the passageway is disposed adjacent to the heater means, and this given end is formed as an outlet for ejecting ink.
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