Cover layer for a substrate support chuck and method of fabricating same
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United States of America Patent
Stats
-
Nov 24, 1998
Grant Date -
N/A
app pub date -
Jun 9, 1997
filing date -
Jun 9, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A cover layer, and method of fabricating the same, for covering a support surface of a workpiece support. More specifically, the cover layer contains a plurality of conductive pads and an insulating material coating. The insulating material coating covers substantially the entire surface of the chuck; however, a top surface of each conductive pad is exposed through the coating. The cover layer maintains a wafer, or other workpiece, in a spaced apart relation to the support surface of the chuck. The distance between the underside surface of the wafer and the chuck is defined by the thickness of conductive pads in the cover layer. The plurality of conductive pads create a plurality of conductive paths from the wafer to the surface of the chuck such that the insulating material layer does not interfere with the Johnsen-Rahbek effect that electrostatically retains the wafer on the chuck.
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