Method of forming electrical interconnects using isotropic conductive adhesives and connections formed thereby
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United States of America Patent
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Dec 1, 1998
Grant Date -
N/A
app pub date -
Jan 26, 1996
filing date -
Jan 26, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for compliant conductive interconnect whereby conductive adhesive is dispensed directly onto conductive sites of a first substrate and, while adhesive is wet or with partial or complete curing, a second substrate is aligned and placed in contact with adhesive deposits, thereby completing the interconnect. After assembly, un-filled underfill shrinks sufficiently to compress compliant adhesive and external clamping is largely eliminated. The method is scalable as low as about 6 mils with no real upper limit according to the percentage conductive particles by volume in the adhesive.
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