Method of forming discrete solder portions on respective contact pads of a printed circuit board
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United States of America Patent
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Dec 1, 1998
Issued Date -
N/A
app pub date -
Sep 5, 1995
filing date -
Feb 5, 1993
priority date (Note) -
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status (Latency Note)
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Abstract
The invention provides for a method of forming discrete solder portions (16) on respective contact pads (10) whereby a strip of solder paste (12) is formed over a plurality of said pads (10). The strip (12) is formed with portions of reduced width (14) which are located over the spaces (22) between adjacent pads (10). The paste is melted and the surface tension at the portions of reduced width (14) causes the movement of solder towards the pads (10) and the separation of the strip (12) into discrete solder portions (16).
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