Gettering of particles from an electro-negative plasma with insulating chuck
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United States of America Patent
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Dec 1, 1998
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N/A
app pub date -
Sep 10, 1996
filing date -
Apr 27, 1995
priority date (Note) -
Expired
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Abstract
Apparatus controls a wafer potential in a plasma system when the plasma is off to keep the wafer slightly negative at all times in order to reduce and eliminate the collection of charged particles on the wafer. The apparatus allows the wafer bias to be reduced to a small negative voltage and then holds that voltage. This greatly reduces the net positive flux to the wafer. A diode and a programmed power supply hold a minimum negative voltage on the back of the wafer electrode when the plasma density is decaying to zero.
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