System and apparatus for reducing arcing and localized heating during microwave processing
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United States of America Patent
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Dec 1, 1998
Issued Date -
N/A
app pub date -
Aug 7, 1997
filing date -
Jun 30, 1995
priority date (Note) -
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Abstract
An apparatus for reducing arcing and localized heating as a result of applying microwave energy to a microelectronic substrate having electronic components thereon is provided. A microwave furnace having a chamber is configured to secure a microelectronic substrate therewithin. The microelectronic substrate is electrically interconnected with a ground connected to an interior wall of the microwave furnace. A holder for securing a microelectronic substrate during the application of microwave energy and for providing the necessary electrical connections for grounding components and circuitry thereon is also provided. The holder may have a heat sink for protection against heat build-up and for maintaining a microelectronic substrate in a substantially flat orientation during microwave processing.
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