Appratus for liquid thermosetting resin molding using radiofrequency wave heating
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United States of America Patent
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Dec 1, 1998
Issued Date -
N/A
app pub date -
Sep 25, 1997
filing date -
Jul 3, 1996
priority date (Note) -
Expired
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Abstract
A method and apparatus for liquid thermoset resin or polymer molding using electromagnetic waves (particularly radiofrequency waves or microwaves), is described. The method and apparatus uses a metal mold (10, 212) with a cavity (401) for the molding as well as for confinement of the electromagnetic waves. Multiple low loss ports (A, B, C, D, E, p1, p2, p3) are provided for introducing the microwaves into the cavity.
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